Exercise 1：
1、What are the development characteristics and trends of microelectronics packaging? (简述最新的电子封装的发展特点及发展趋势。)
2、The classification and characteristics of wire bonding.(引线键合（WB）的分类及特点)。
3、The working principle and main process of the wire ball bonding (金丝球焊的主要工艺过程及其工作原理)。
4、What is UBM? Describe the UBM’s structure and materials involved in it, and the roles of each layer.（什么是UBM？简述倒装焊芯片UBM的结构及各层的主要作用。）
5、The function of the underfill in the Flip-Chip packages.